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Liquid Cooling Technology

Liquid Cooling Technology

Immersion liquid - cooled all - in - one machine

Adopt the advanced direct liquid-cooled immersion heat dissipation technology, directly and completely immerse the heat of the equipment in the insulating coolant to ensure the rapid and stable transfer of the equipment's heat to the coolant. The coolant is circulated to the heat exchange end of the system and then to the radiator for processing, effectively maintaining the stability and high efficiency of the equipment operation. Through the in - depth integration of the micro - immersion cabinet, enterprise cloud servers and the hardware resource management platform, users can easily build a data center with enterprise cloud functions locally.

Liquid cooling heat dissipation system

The liquid cooling system is a high - efficiency cooling solution specifically designed to solve the computer heat dissipation problem and can handle heat dissipation requirements of up to 12000W. This device consists of components such as a water - cooled radiator, a water pump, a water tank, a cold plate, a fan, and hoses. The coolant circulates in the system to ensure that the chip remains at a low temperature during high - load operation. It has excellent heat dissipation effects and can meet the heat dissipation needs of high - performance computers during long - term high - load operation, bringing users an excellent usage experience.

Liquid cooling heat exchange unit

The cabinet - type liquid - cooled heat exchange unit (CDU) is mainly composed of components such as cabinets, water pumps, plate heat exchangers, valves, canned pumps, and pipes. Materials such as corrosion - resistant stainless steel (304/316) and titanium alloy are used, and they are passivated and chemically treated. The working principle is that the water pump pumps the filtered coolant to the plate heat exchanger. After being cooled by the plate heat exchanger, the coolant is sent to the liquid - cooling system to cool the heat source. In this way, the heat source is continuously dissipated through such a cycle.

Cold plates are high - efficiency radiators, precisely manufactured with high - quality materials and combined with high - thermal - conductivity coatings, which can meet the strong heat dissipation requirements of up to 20,000W. Inside, there is a composite double - cavity flow channel, which transfers and cools heat energy through heat transfer, providing excellent heat dissipation effects for electronic devices and effectively boosting the performance of the devices. They can be widely used in fields such as computers, servers, and communication devices.

Manifold Water Divider / Water Distribution Pipe

Manifold is a key component in the liquid cooling system. It is mainly used to connect the main pipeline between the chilled liquid distribution unit (CDU) of the liquid - cooled cabinet and the cold plate, ensuring that the coolant can be evenly distributed to each server and providing efficient circulation of the coolant. This connection method not only ensures the efficient operation of the cooling system but also helps maintain the temperature balance of the entire data center.

Fluid connector

The TSN series of triple - groove liquid helium type and the TSA series of external clamping type fluid connectors we offer are both designed for efficient and safe connections, meeting various application requirements. The TSN series supports quick plug - and - play and automatic sealing to prevent leakage, and provides a lightweight housing made of aluminum alloy or stainless steel. The TSA series uses a push - pull connection operation to ensure reliable sealing, has the characteristic of resistance to random vibration, and provides diverse installation methods and customizable pressure - resistant passages.

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